Determination of spincoating uniformity and wafer to wafer uniformity of the APT Spincoating system using AZ5214E resist.
( By: T. Zijlstra TUDelft B. de Lange TUDelft B. van Weelde SPS )
- APT SpincoaterÀÇ Æ¯Â¡
Wafer uniformityÀÇ Çâ»óÀ» À§ÇÑ 2 Point
1. acceleration during ramp up: Changing the acceleration resulted in more smooth resist films,
i.e. ¡°comet¡± tails disappeared when the acceleration during ramp up was increased to 1000 rpm per second, with a final spinning speed of 5000 rpm.
2. Airflow in the spinbowl: Reducing the the airflow to zero resulted in circular uniformal resist pattern on the wafer