½ºÇÉÄÚÅÍ(Spincoater) ¸¶½ºÅ©¾ó¶óÀ̳Ê(Mask Aligner) Æĸ±·»ÄÚÅÍ(Pparylene Coater)

Spincoater Home
 
Polos Spin200   

APT spin200
 
  • Ideal for Process R&D
  • Material Size: ¨ª8¡±Wafer or 6¡±square Glass
  • RPM: 1 ~12.000 rpm : 300RPM ÀÌÇÏÀÇ Àú¼Ó Á¦¾î°¡´É
    (for mechanical/non-vacuumchuckswe recommend max. 3.000rpm)
  • Program:¹«ÇÑ ÇÁ·Î±×·¥, ¹«ÇÑ ½ºÅÜ °¡´É
  • Accuracy (+/-0.1 rpm),Digital control Stepping Motor
  • Chemical resistant NPP or Teflon Bowl
  • Digital Process Controller-easy step-by-step
  • Acceleration/Deacceleration max:30,000 rpm/sec
  • Clear Lid with 19mm center hole
  • Drain Port, Nitrogen Purge Port
  • Specially designed Bowl for Anti-Reflection & Reducing the the airflow to zero
  • Safety Door Interlock:Rotating stops when opening door
  • Centering Tool Included
  • German-APT Made CE-approved
  • Remote control pannel available (Globebox »ç¿ë½Ã À¯¿ë)
  • chuck :Fragment ,6-8''wafer
  • ¿ëµµ : ¿þÀÌÆÛ PR ÄÚÆÃ,À¯±â¹Ú¸·ÄÚÆÃ,
    ITO Glass ¹Ú¸·ÄÚÆÃ

    ÀÛµ¿ ¸ð½À



    Determination of spincoating uniformity and wafer to wafer uniformity of the APT Spincoating system using AZ5214E resist.
    ( By: T. Zijlstra TUDelft B. de Lange TUDelft B. van Weelde SPS )

    - APT SpincoaterÀÇ Æ¯Â¡
    Wafer uniformityÀÇ Çâ»óÀ» À§ÇÑ 2 Point

    1. acceleration during ramp up: Changing the acceleration resulted in more smooth resist films,
    i.e. ¡°comet¡± tails disappeared when the acceleration during ramp up was increased to 1000 rpm per second, with a final spinning speed of 5000 rpm.

    2. Airflow in the spinbowl: Reducing the the airflow to zero resulted in circular uniformal resist pattern on the wafer

  • Wafer to wafer uniformity:
    ** For these experiments we used the ¡°optimized¡± conditions,
    i.e. a ramp up of 1000 rpm per second for five seconds, then a spinning speed of 5000 rpm for 55 seconds.
    The airflow in the spinning bowl was reduced to zero.


    1. The spinning conditions for AZ 5214E was optimized, although we are convinced that conditions could have been further optimized if we would have had more time available.
    2. The wafer uniformity found, is better than 2.5%
    3. The wafer to wafer uniformity was found to be 3%.
    4. Improving the experimental setup would probably resulted in better wafer uniformity and wafer to wafer uniformity.



  • Å°º¸µå ÇÁ·Î±×·¥ °úÁ¤

 

 
 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

                                          °æ±âµµ ¾È¾ç½Ã µ¿¾È±¸ È£°è 555-9
                                           ¾È¾ç ±¹Á¦ À¯Åë´ÜÁö 17µ¿ 127È£
                                          Tel : (031) 479-4211/2, Fax : (031) 479-4213

                                                    1992-2008 ,Jsi.co. All rights reserved  

                                                    Contact us : jsi@jsits.com

½ºÇÉÄÚÅÍ/Spincoater ½ºÇÉÄÚÅÍ/Spincoater ½ºÇÉÄÚÅÍ/Spincoater ½ºÇÉÄÚÅÍ/Spincoater ½ºÇÉÄÚÅÍ/Spincoater ½ºÇÉÄÚÅÍ/Spincoater ½ºÇÉÄÚÅÍ/Spincoater